Engineers from Stanford University are claiming to have broken new ground with the first post-process diamond integration of ...

For the last year Japanese chemical company Resonac and Tohoku University have been exploring using SiC powder, produced from ...

Troubled US SiC semiconductor company Wolfspeed has appointed Gregor Van Issum as CFO, effective September 1, 2025. He ...

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The project also benefits from strong industry backing, with six partners contributing technical expertise and in-kind ...

Infineon has announced that its scalable GaN manufacturing on 300mm wafers is on track, with first samples available for ...

SiC chipmaker files for Chapter 11 as next step in restructuring agreement SiC chipmaker Wolfspeed has filed for Chapter 11 ...

Navitas' GaN IC portfolio is expected to use Powerchip’s 200mm in Fab 8B, located in Zhunan Science Park, Taiwan. The fab has ...

Aixtron SE, Fraunhofer IISB and Bimanu Cloud Solutions are cooperating in a €28.4 million project called 'Increasing Energy ...

TrendForce says that TSMC plans to repurpose its Hsinchu Fab 5, which handles GaN production, for advanced packaging.

To fabricate their devices, Li and co-workers began by using pulsed laser deposition (PLD) to grow a roughly 50 nm-thick film ...

Migrating to the unlicensed visible light spectrum, which spans 400 THz to 800 THz, accesses a vast bandwidth, enabling VLC ...